Editor:  Yanhua Zhao


Thermal analysis - properties of materials studied as they change with temperature

LS-DYNA can solve steady state and transient heat transfer problems on 2-D and 3-D dimensional parts, cylindrical symmetric parts (axisymmetric). Heat transfer can be coupled with other features in LS-DYNA to provide modeling capabilites for thermal-stress coupling.

Heat Transfer Analysis – encompasses many applications such as the importance of bake design.  Understanding the temperature increase of the disk brake rotor and pads due to frictional heating and resulting mechanical distortion
 AVI 75 Disk Brake 7.4 MB

 AVI Library 71a Multi Forging

 Forging #71: A non-isothermal forging is modeled.  A hot workpiece is placed in a cold die. Note the contact locations between the workpiece and the punch and die. The workpiece is seen to cool down at these contact locations as heat is transferred to the cold punch and die

Thermal Analysis, using finite element techniques, is carried out as a steady-state or transient analysis. Conductive heat transfer is handled directly by finite element techniques; conduction occurs in a solid due to temperature differences. However, radiation heat transfer analysis may require additional particle-tracking or ray-tracing techniques to approximate the radiant energy arriving at a given surface.

Convective heat transfer occurs due to the swirling motion of a fluid at a non-uniform temperature, owing to its variation in density and the action of gravity. A common way to handle convection is through convective heat transfer coefficients. Advanced simulation codes may couple fluid, thermal, and structural analysis in order to study the multi-physics effect on the design of equipment and structures.

LS-DYNA couples thermal and structural analysis through coupled constitutive models; the user may select thermal elastic and viscoelastic materials for such an analysis. LS-DYNA additionally provides compressible and incompressible fluid dynamics analysis capabilities.